ULTRASOUND PROBE AND MANUFACTURING METHOD FOR THE SAME

摘要

An ultrasonic probe according to an aspect of the present invention includes a connection layer including a conductor array for connecting a transducer array and a printed circuit board (PCB) to an application specific integrated circuit (ASIC). The ultrasonic probe according to an embodiment includes: a transducer array which transmits and receives an ultrasonic wave; a first electronic circuit electrically connected to the transducer array; a second electronic circuit electrically connected to the first electronic circuit; and a connection layer disposed between the transducer array and the first electronic circuit, and including a first conductor array being in contact with the transducer array so that the transducer array is electrically connected to the first electronic circuit and a second conductor array being in contact with the second electronic circuit so that the second electronic circuit is electrically connected to the first electronic circuit.