| 摘要 |
The present invention relates to a UV curing apparatus using light emitting diodes (LEDs). According to an embodiment of the present invention, provided is a UV curing apparatus comprising: a light source unit which comprises a plurality of LEDs, and in which the LEDs generate beams; and a heat sink unit which dissipates heat generated in the light source unit. The light source unit comprises a plurality of LEDs, a plurality of substrates in which the LEDs are mounted thereon, and a printed circuit board (PCB) in which the substrates are arranged in a direction and are installed thereon, wherein some of the LEDs are mounted on the substrates so that the some of the LEDs are disposed along an axis along which the substrates are arranged. According to the present invention, a plurality of LEDs are uniformly disposed in respective regions divided in vertical and lateral directions in a plane of the substrates, so rays of light emitted from the LEDs overlap each other and thus form Gaussian shaped beams, thereby providing an effect of increasing uniformity of light generated by the UV curing apparatus. |
