Stacked microelectronic dice embedded in a microelectronic substrate

摘要

Embodiments of the present description include stacked microelectronic dice embedded in a microelectronic substrate and methods of fabricating the same. In one embodiment, at least one first microelectronic die is attached to a second microelectronic die, wherein an underfill material is provided between the second microelectronic die and the at least one first microelectronic die. The microelectronic substrate is then formed by laminating the first microelectronic die and the second microelectronic die in a substrate material.

主权项

1. A microelectronic device, comprising:
at least one first microelectronic die; a second microelectronic die, wherein the at least one first microelectronic die is attached to the second microelectronic die with a plurality of interconnects; an underfill material disposed between the at least one first microelectronic die and the second microelectronic die; and wherein the at least one first microelectronic die and the second microelectronic die are embedded within a microelectronic substrate, wherein the microelectronic substrate comprises a first laminate layer and a second laminate layer; wherein an interface forms between the first laminate layer and the second laminate layer, and wherein the interface abuts one of the underfill material, the first microelectronic die, and the second microelectronic die.