Resin application apparatus, optical property correction apparatus and method, and method for manufacturing LED package

摘要

A resin application apparatus includes: an optical property measurement unit measuring an optical property of light emitted from a light emitting diode (LED) chip which is mounted on a package body and to which transparent resin is not applied; and a resin application unit applying light conversion material-containing transparent resin to the LED chip in accordance with a resin application amount which is decided depending on the optical property measured by the optical measurement unit.

主权项

1. A method for manufacturing an LED package, comprising:
attaching LED chips to a plurality of package bodies of a package array having a structure in which the plurality of package bodies are arranged, wherein the plurality of package bodies include a plurality of positive electrodes and a plurality of negative electrodes, each of the plurality of package bodies includes at least one of the plurality of positive electrodes and at least one of the plurality of negative electrodes, and each of the plurality of positive electrodes is isolated from the plurality of negative electrodes; forming a plurality of LED packages by dispensing phosphor-containing resin to the respective package bodies having the LED chip attached thereto; inspecting the optical properties of the respective LED packages in a state in which a voltage is applied to the respective LED chips of the package array to emit light; and singulating the LED packages by separating the LED packages from the package array, wherein the inspection of the optical properties comprises inspecting the optical properties of the plurality of LED packages at the same time in a state in which a light receiving array including a plurality of light inspection units is positioned adjacent to the package array.