发明名称 COOLING STRUCTURE OF COIL
摘要 PROBLEM TO BE SOLVED: To provide a cooling structure of a coil capable of suppressing breakdown of a cooling plate due to thermal expansion during energization of the coil, while ensuring heat transference from the end face of the coil to the cooling plate.SOLUTION: A cooling structure of a coil includes a coil 30 having a strip conductor wound multiple number of turns about a predetermined axis, an alumina layer 39 formed on the end face of the coil 30 in the direction of the predetermined axis by spray coating, and having a flattened surface, a cooling plate 41 formed principally of alumina in plate shape, and having a flow path 41a of cooling medium formed internally, and an adhesive 40 for bonding the alumina layer 39 and cooling plate 41, and deforming elastically depending on the difference of thermal expansion amount between the alumina layer 39 and cooling plate 41.SELECTED DRAWING: Figure 1
申请公布号 JP2016115709(A) 申请公布日期 2016.06.23
申请号 JP20140250817 申请日期 2014.12.11
申请人 CKD CORP;ARAKAWA CHEM IND CO LTD 发明人 ITO AKIHIRO;KOKETSU MASAYUKI;HOSONO TAKASHI;MUTO SADAYOSHI;TASAKI TAKASHI;OGAWA YUSHI
分类号 H01F27/28;H01F7/06;H01F27/16 主分类号 H01F27/28
代理机构 代理人
主权项
地址