SOLUTION TO DEAL WITH DIE WARPAGE DURING 3D DIE-TO-DIE STACKING

摘要

Provided is a method for forming a contact pad array on an integrated circuit board and depositing solder on an accessible region of the contact pads. Wherein, the contact pad array includes a plurality of first contact pads and a plurality of second contact pads. Each accessible region of the first contact pads is different from each accessible region of the second contact pad. An apparatus includes the integrated circuit board. The integrated circuit board includes a body with a non-planar shape and a surface which includes the first contact pads and the second contact pads and each accessible region of the first contact pads is different from each accessible region of the second contact pads.