SIDE EMITTING LED PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

Disclosed are a side-emitting LED package capable of increasing a reflection efficiency by using a flip-chip packaging and a method for manufacturing the same. According to the present invention, the method for manufacturing the side-emitting LED package comprises the steps of: forming a first reflective plating layer on a lead frame; after a lead frame processing including a forming step of an injection part which has a light radiation surface on the side and has a mounting space formed by making one portion of the lead frame opened, die bonding a light emitting diode chip in the mounting space of the lead frame by using a flip-chip method, but the die bonding being performed by a reflow bonding; forming a second reflective plating layer on the lead frame after performing the reflow bonding; forming a molding resin part in the mounting space after forming the second reflective plating layer; and forming a reflection part in which a side of the light radiation surface provided on the side is wider than the opposite side.