| 发明名称 | Composite processors | ||
| 摘要 | In one example, a composite processor includes a circuit board, a first processor element package, and a second processor element package. The circuit board has an optical link and an electrical link. The first processor element package includes a substrate with an integrated circuit, a sub-wavelength grating optical coupler, and an electrical coupler coupled to the electrical link of the circuit board. The second processor element package includes a substrate with an integrated circuit, a sub-wavelength grating optical coupler, and an electrical coupler coupled to the electrical link of the circuit board. The sub-wavelength grating optical coupler of the first processor element package, the optical link of the circuit board, and the sub-wavelength grating optical coupler of the second processor element package collectively define an optical communications path between the substrate of the first processor element package and the substrate of the second processor element package. | ||
| 申请公布号 | US8929694(B2) | 申请公布日期 | 2015.01.06 |
| 申请号 | US201113978039 | 申请日期 | 2011.01.20 |
| 申请人 | Hewlett-Packard Development Company, L.P. | 发明人 | Beausoleil Raymond G;Fiorentino Marco;McLaren Moray;Astfalk Greg;Binkert Nathan Lorenzo;Fattal David A. |
| 分类号 | G02B6/12;G06F15/80;G06F3/00 | 主分类号 | G02B6/12 |
| 代理机构 | Hewlett-Packard Patent Department | 代理人 | Hewlett-Packard Patent Department ;Searle Benjamin |
| 主权项 | 1. A composite processor, comprising: a circuit board having an optical link and an electrical link; a first processor element package including a substrate having an integrated circuit, a sub-wavelength grating optical coupler, and an electrical coupler, the electrical coupler of the first processor element package coupled to the electrical link of the circuit board; and a second processor element package including a substrate having an integrated circuit, a sub-wavelength grating optical coupler, and an electrical coupler, the electrical coupler of the second processor element package coupled to the electrical link of the circuit board, the sub-wavelength grating optical coupler of the first processor element package, the optical link of the circuit board, and the sub-wavelength grating optical coupler of the second processor element package collectively defining an optical communications path between the substrate of the first processor element package and the substrate of the second processor element package. | ||
| 地址 | Houston TX US | ||