| 摘要 |
The purpose of the present invention is to perform the division of a package substrate, which has a device arranged on a heat-diffusing substrate and is sealed by resin, efficiently without generating burrs. Conducted are: a cutting groove forming process of immersing a cutting blade (32) in resin to a depth not reaching a heat-diffusing substrate (11) and cutting the resin along a division line (14), thereby enabling the resin (13) to remain; a resin cutting process of radiating an infrared laser beam having a wavelength absorptive with respect to the resin (13) along the cutting groove, thereby cutting the remaining resin; and a division process of radiating a laser beam having a wavelength absorptive with respect to the exposed heat-diffusing substrate (11), thereby cutting the heat-diffusing substrate (11) along the division line (14) and dividing the heat-diffusing substrate into individual package devices. Accordingly, time required to cut the resin (13) and time required to cut the heat-diffusing substrate (11) are reduced and overall time required to divide a package substrate is reduced. |
