Methods of fabricating multiple gate stack compositions

摘要

A method including providing a substrate having a first region, a second region, and a third region defined thereupon. A first interfacial layer is formed over the first region, the second region, and the third region. The first interfacial layer is etched to remove a portion of the first interfacial layer from the first region and a portion of the first interfacial layer from the second region. Etching of the first interfacial layer defines a gate stack within the third region. After the etching of the first interfacial layer, a second interfacial layer is formed over at least a portion of the second region. The second interfacial layer is etched to define a gate stack within the second region. After the etching of the second interfacial layer, a third interfacial layer is formed on the substrate over at least a portion of the first region to define a gate stack within the first region.

主权项

1. A method of forming an integrated circuit, the method comprising:
forming a first interfacial layer over a first region, a second region, and a third region of a substrate; patterning the first interfacial layer to remove a portion of the first interfacial layer from the first region, wherein the patterning of the first interfacial layer defines a first gate stack having a first gate stack height within the third region, wherein the first gate stack includes:
the first interfacial layer having a first thickness,a first dielectric layer on the first interfacial layer,a first capping layer on the first dielectric layer, anda first electrode layer over the first capping layer; forming, after the patterning of the first interfacial layer, a second interfacial layer over at least a portion of the second region; patterning the second interfacial layer to define a second gate stack within the second region, wherein the second gate stack has the first gate stack height and includes:
the second interfacial layer of a second thickness,a second gate dielectric layer on the second interfacial layer,a second capping layer over the second gate dielectric layer, anda second electrode layer over the second capping layer; and forming, after the patterning of the second interfacial layer, a third interfacial layer on the substrate over at least a portion of the first region to define a third gate stack within the first region the third gate stack within the first region has the first gate stack height, and wherein the third gate stack includes:
the third interfacial layer of a third thickness,a third gate dielectric on the third interfacial layer,a third capping layer over the third gate dielectric, anda third electrode layer over the third capping layer, wherein the first thickness is greater than the second thickness and the second thickness is greater than the third thickness.