| 发明名称 | Flexible wiring substrate, method for assembling flexible wiring substrate, and method for manufacturing liquid jetting apparatus | ||
| 摘要 | A flexible wiring substrate includes: a flexible base material; a wire provided on the base material; and an inspection wire provided on the base material, having an inspection segment which breaks up under a condition that the inspection segment is folded with not less than a predetermined curvature and a non-inspection segment which does not break up under a condition that the non-inspection segment is folded with not less than the predetermined curvature. | ||
| 申请公布号 | US8927874(B2) | 申请公布日期 | 2015.01.06 |
| 申请号 | US201213368520 | 申请日期 | 2012.02.08 |
| 申请人 | Brother Kogyo Kabushiki Kaisha | 发明人 | Koide Shohei;Suzuki Yusuke;Kawano Mizuyo;Mizutani Hiromitsu |
| 分类号 | H05K1/00;B41J2/14;H05K1/02 | 主分类号 | H05K1/00 |
| 代理机构 | Frommer Lawrence & Haug LLP | 代理人 | Frommer Lawrence & Haug LLP |
| 主权项 | 1. A flexible wiring substrate comprising: a flexible base material; a wire provided on the base material; and an inspection wire provided on the base material, having an inspection segment which breaks up under a condition that the inspection segment is folded with not less than a predetermined curvature and a non-inspection segment which does not break up under a condition that the non-inspection segment is folded with not less than the predetermined curvature; wherein the flexible base material is folded with not less than the predetermined curvature at a region in which the inspection segment of the inspection wire is arranged. | ||
| 地址 | Aichi-ken JP | ||