| 发明名称 | Chemical mechanical polishing (CMP) composition comprising a specific heteropolyacid | ||
| 摘要 | A chemical mechanical polishing (CMP) composition comprising a specific heteropolyacid Abstract A chemical-mechanical polishing (CMP) composition comprising: (A) inorganic particles, organic particles, or a mixture thereof, (B) a heteropolyacid of the formula HaXbPsMOyVzOc wherein X=any cation other than H 8<y<18 8<z<14 56<c<105 a+b=2c−6y−5(3+z) b>0 and a>0 (formula I) or a salt thereof, and, (C) an aqueous medium. | ||
| 申请公布号 | US8927429(B2) | 申请公布日期 | 2015.01.06 |
| 申请号 | US201113877759 | 申请日期 | 2011.10.04 |
| 申请人 | BASF SE | 发明人 | Schmitt Christine;Karpov Andrey;Rosowski Frank;Brands Mario;Li Yuzhuo |
| 分类号 | H01L21/306;H01L21/321;C09G1/02 | 主分类号 | H01L21/306 |
| 代理机构 | Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P. | 代理人 | Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P. |
| 主权项 | 1. A chemical-mechanical polishing CMP composition, comprising: (A) inorganic particles, organic particles, or a mixture thereof, (B) a heteropolyacid of empirical formula I: HaXbP3MoyVzOc wherein X is a cation other than H, 8≦y≦188≦z≦1456≦c≦105a+b=2c−6y−5(3+z)b≧0, anda>0, or a salt thereof, and (C) an aqueous medium. | ||
| 地址 | Ludwigshafen DE | ||