发明名称 Method for improving connector enclosure adhesion
摘要 An improved method is employed to attach an enclosure to a connector body having relatively small geometry. One or more bonding channels are disposed in the outside surface of the connector body. During assembly of an enclosure over the connector body, a bonding material is distributed within the bonding channels and subsequently cured. The bonding channels and the bonding material are designed to employ capillary wicking to aid in the distribution of the bonding material within the bonding channels.
申请公布号 US8926337(B2) 申请公布日期 2015.01.06
申请号 US201213722887 申请日期 2012.12.20
申请人 Apple Inc. 发明人 Siahaan Edward;Webb Michael
分类号 H01R11/30;H01R13/46;H01R43/00;H01R13/504;H01R24/60 主分类号 H01R11/30
代理机构 Kilpatrick Townsend & Stockton LLP 代理人 Kilpatrick Townsend & Stockton LLP
主权项 1. A connector comprising: a body having first and second faces on opposite sides of the body and an outside surface that extends between the first and second faces; a bonding channel extending along the outside surface of the body, the bonding channel having an entry at the first face; a plug extending from the second face of the body to a distal end of the connector; a plurality of contacts carried by the plug; and an enclosure that surrounds the outside surface of the body covering the bonding channel and is bonded to the body by bonding material disposed within the bonding channel.
地址 Cupertino CA US