发明名称 Methods for fabricating circuit boards
摘要 A method, and apparatus resulting from the method, for fabricating a circuit board suitable for mounting electronic components. The method includes drilling a plurality of through-holes in a plurality of dielectric sheets, forming a conductive film on at least one side of each of the plurality of dielectric sheets, and substantially filling each of the plurality of through holes with a conductive material. The conductive material is both electrically and thermally uninterrupted from a first face to a second face of each of the plurality of dielectric sheets. The plurality of dielectric sheets are then sequentially mounted, one atop another, to form the circuit board. The sequential mounting step is performed after the steps of drilling the plurality of through-holes, forming the conductive layer, and substantially filling the plurality of through-holes.
申请公布号 US8925193(B2) 申请公布日期 2015.01.06
申请号 US201012830805 申请日期 2010.07.06
申请人 Advantest (Singapore) Pte Ltd 发明人 Mayder Romi O.
分类号 H01K3/10;H05K3/46;H05K1/02;G01R31/28;H05K1/11 主分类号 H01K3/10
代理机构 代理人
主权项 1. A method for fabricating a circuit board suitable fir mounting electronic components, the method comprising drilling a plurality of through-holes in a plurality of dielectric sheets; forming a conductive film on at least one side of each of the plurality of dielectric sheets having the plurality of through-holes, substantially plating/filling each of the plurality of through-holes with a conductive material after forming the conductive film on each of the plurality of dielectric sheets, the conductive material being, electrically and thermally uninterrupted from a first face to a second face of each of the plurality of dielectric sheets and not made with silver epoxy or copper epoxy; and sequentially mounting each of the plurality of dielectric sheets, one atop another, to form the circuit board with at least one of the plurality of filled through-holes of each dielectric sheet being aligned to define at least one via that extends between opposing, side surfaces of the circuit board, the sequential mounting step being performed after the steps of drilling the plurality of through-holes, forming the conductive layer, and substantially filling the plurality of through-holes.
地址 Singapore SG
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