| 摘要 |
PROBLEM TO BE SOLVED: To provide a plasma processing apparatus that can perform high-speed processing and stably use plasma.SOLUTION: In an inductively coupled type plasma torch unit T, a coil 3, a first ceramic block 4 and a second ceramic block 5 are arranged in parallel, and an elongated chamber 7 is annular. Plasma P generated in the chamber 7 is jetted from an opening portion 8 of the chamber 7 to a base material 2. The elongated chamber 7 and a base material mount table 1 are relatively moved in a direction vertical to the longitudinal direction of the opening portion 8 to process the base material 2. Discharge suppressing gas is introduced into the space between the inductively coupled type plasma torch unit T and the base material 2 inside the chamber 7 through a discharge suppressing gas supply hole 13 to stably generate elongated plasma.SELECTED DRAWING: Figure 1 |
