发明名称 Insert molded cowling structures
摘要 Electronic devices may be provided with electronic components and cowling structures that secure the electronic components. A cowling structure may include a metal portion and an insulating portion that has been insert-molded onto the metal portion. The metal portion and the insert-molded insulating portion may each have an opening that receives a screw. The screws may pass through the respective opening and attach to a substrate. The substrate may be a transparent cover layer for a device display. The cowling structure may press the electronic components against the transparent substrate layer. The device may include an antenna. The insert-molded insulating portion may extend from an edge of the metal portion in the direction of the antenna. The insert-molded insulating portion may prevent one of the screws from forming an electrical connection with the metal portion.
申请公布号 US8927881(B2) 申请公布日期 2015.01.06
申请号 US201213607440 申请日期 2012.09.07
申请人 Apple Inc. 发明人 Wittenberg Michael B.;Cohen Sawyer I.;Kole Jared M.;Malek Shayan;Pakula David A.;Shukla Ashutosh Y.
分类号 H05K7/14 主分类号 H05K7/14
代理机构 Treyz Law Group 代理人 Treyz Law Group ;Woodruff Kandall P.
主权项 1. An electronic device, comprising: a substrate; an electronic component mounted against the substrate; and a support structure having a metal portion in contact with the electronic component that presses the electronic component against the substrate, wherein the metal portion comprises at least one engagement feature that extends into and is at least partially surrounded by an insert-molded insulating portion and wherein the insert-molded insulating portion extends laterally from the metal portion.
地址 Cupertino CA US