发明名称 |
MULTI-STEP AND ASYMMETRICALLY SHAPED LASER BEAM SCRIBING |
摘要 |
<p>Methods of dicing substrates by both laser scribing and plasma etching. A method includes laser ablating material layers, the ablating leading with a first irradiance and following with a second irradiance, lower than the first. Multiple passes of a beam adjusted to have different fluence level or multiple laser beams having various fluence levels may be utilized to ablate mask and IC layers to expose a substrate with the first fluence level and then clean off redeposited materials from the trench bottom with the second fluence level. A laser scribe apparatus employing a beam splitter may provide first and second beams of different fluence from a single laser.</p> |
申请公布号 |
KR20150001829(A) |
申请公布日期 |
2015.01.06 |
申请号 |
KR20147032005 |
申请日期 |
2012.05.25 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
LEI WEI SHENG;EATON BRAD;YALAMANCHILI MADHAVA RAO;SINGH SARAVJEET;KUMAR AJAY;HOLDEN JAMES M. |
分类号 |
H01L21/78;H01L21/301;H01L21/76 |
主分类号 |
H01L21/78 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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