| 发明名称 | Immersion-cooling of selected electronic component(s) mounted to printed circuit board | ||
| 摘要 | A method is provided for pumped immersion-cooling of selected electronic components of an electronic system, such as a node or book of a multi-node rack. The method includes providing a housing assembly defining a compartment about the component(s) to be cooled, which is coupled to a first side of a printed circuit board. The assembly includes a first frame with an opening sized to accommodate the component(s), and a second frame. The first and second frames are sealed to opposite sides of the board via a first adhesive layer and a second adhesive layer, respectively. The printed circuit board is at least partially porous to a coolant to flow through the compartment, and the first frame, second frame, and first and second adhesive layers are non-porous with respect to the coolant, and provide a coolant-tight seal to the first and second sides of the printed circuit board. | ||
| 申请公布号 | US8929080(B2) | 申请公布日期 | 2015.01.06 |
| 申请号 | US201313788987 | 申请日期 | 2013.03.07 |
| 申请人 | International Business Machines Corporation | 发明人 | Campbell Levi A.;Chu Richard C.;David Milnes P.;Ellsworth, Jr. Michael J.;Iyengar Madhusudan K.;Schmidt Roger R.;Simons Robert E. |
| 分类号 | H05K7/20;H01L23/473 | 主分类号 | H05K7/20 |
| 代理机构 | Heslin Rothenberg Farley & Mesiti P.C. | 代理人 | Chiu, Esq. Steven;Radigan, Esq. Kevin P.;Heslin Rothenberg Farley & Mesiti P.C. |
| 主权项 | 1. A method of facilitating cooling of an electronic component, the method comprising: providing a housing assembly defining a compartment about the at least one electronic component, the at least one electronic component being coupled to a first side of a printed circuit board, and the providing of the housing assembly comprises: providing a first frame comprising at least one opening sized to accommodate the at least one electronic component therein, and coupling the first frame to the first side of the printed circuit board employing a first adhesive layer between the first frame and the printed circuit board;providing a second frame and coupling the second frame to a second side of the printed circuit board employing a second adhesive layer to seal the second frame to the second side of the printed circuit board, wherein the first side and the second side of the printed circuit board are opposite sides of the printed circuit board,wherein the printed circuit board is at least partially porous to a coolant to flow through the compartment for cooling the at least one electronic component, andwherein the first frame, the second frame, the first adhesive layer, and the second adhesive layer, are non-porous with respect to the coolant and provide a coolant-tight seal to the first side and the second side of the printed circuit board. | ||
| 地址 | Armonk NY US | ||