Image sensor packaging structure with black encapsulant

摘要

An image sensor packaging structure with a low transmittance encapsulant is provided. The image sensor packaging structure includes a substrate, a chip, a transparent lid, and the low transmittance encapsulant. The chip is combined with the substrate. The transparent lid is adhered to the chip and cover above a sensitization area of the chip to form an air cavity. The low transmittance encapsulant is formed on the substrate and encapsulates the chip and the transparent lid so as to accomplish the package of the image sensor packaging structure. Due to the feature of prohibiting from light passing through the low transmittance encapsulant, the arrangement of the low transmittance encapsulant can avoid the light from outside interfere the image sensing effect of the image sensor. Therefore, the quality of the image sensing can be ensured.

主权项

1. An image sensor packaging structure with a black encapsulant, the image sensor packaging structure comprising:
a substrate having a carrying surface and a bottom surface, the carrying surface having formed thereon a plurality of first conductive contacts; a chip fixedly positioned on the substrate and having a first surface, a second surface and a plurality of second conductive contacts, the first surface being coupled to the carrying surface of the substrate, the second surface being defined with a sensitization area, and the second conductive contacts being signal-connected to the first conductive contacts; a support having an upper surface and a lower surface with an opening defined through the support, the support being fixedly positioned on the second surface of the chip with the opening positioned with and surrounding the sensitization area of the chip, wherein the lower surface of the support is adhered to the second surface of the chip with an adhesive layer between the sensitization area and the second conductive contacts: a transparent lid having an upper surface and a lower surface fixedly positioned on the upper surface of the support above the sensitization area foaming an air cavity; a dam formed on the upper surface of the transparent lid along an outer periphery thereof to surround an inner portion of the upper surface of the transparent lid; and a black encapsulant formed on the substrate to encapsulate the carrying surface of the substrate, the first and second conductive contacts, and outer peripheral surfaces of the chip, the support and the transparent lid, wherein the black encapsulant is formed to surround and directly contact with an outer periphery of the transparent lid and an outer periphery of the dam, the upper surface of the black encapsulant is formed higher than the upper surface of the transparent lid and coplanar with a topmost surface of the dam and the dam is positioned to directly contact with the black encapsulant away from the inner portion of the upper surface of the transparent lid surrounded by the dam.