| 摘要 |
PROBLEM TO BE SOLVED: To provide a dicing sheet which enhances an adhesive strength of an adhesive layer before energy ray irradiation thereby to prevent scattering of semiconductor components and inhibit generation of dicing scraps to prevent adhesion of the dicing scraps to lateral faces of the semiconductor components and contamination of a device due to the dicing scraps.SOLUTION: A dicing sheet comprises a base material, and an adhesive layer formed on the base material. The adhesive layer is composed of an adhesive composition including copolymer (A) including a monomer unit introduced from aromatic (meth) acrylate and at least one kind of energy ray polymerizable compound (B) selected from a cyanurate compound having a group including carbon-carbon double bands and isocyanurate compound having a group including carbon-carbon double bands. The adhesive layer has a thickness of 8-20 μm. A content of the monomer unit introduced from the aromatic (meth) acrylate is 20-80 pts.mass based on 100 pts.mass of the copolymer (A). |
