Estimating power supply of a 3D IC

摘要

Embodiments of present invention include a method and apparatus of estimating power supply of a 3D IC. The method particularly includes obtaining current information and layout information of circuit modules contained in a specific region of the 3D IC, gridding the specific region so as to form at least one three-dimensional grid having a plurality of side edges along chip stacking direction of the 3D IC, determining current of at least one of the plurality of side edges based on the current information and layout information of the circuit modules, and estimating power supply of the 3D IC based on the current of the at least one side edge. With the method and apparatus embodiments of the invention, power supply of a 3D IC may be effectively estimated and analyzed.

主权项

1. A computer program product for estimating power supply of a three dimensional (3D) integrated circuit (IC), the computer program product comprising a non-transitory computer readable storage medium having program instructions embodied therewith, the program instructions readable to cause a processing unit to:
obtain current information and layout information of circuit modules contained in a specific region of the 3D IC; grid the specific region so as to form at least one three-dimensional grid having a plurality of side edges along chip stacking direction of the 3D IC; determine current of at least one side edge of the plurality of side edges based on the current information and layout information of the circuit modules by determining, based on layout information of circuit modules, distances from the circuit modules to the at least one side edge to determine current distribution weights of the circuit modules to the at least one side edge and performing weighted summation on current of at least a portion of the circuit modules as the current of the at least one side edge; and estimate power supply of the 3D IC based on the current of the at least one side edge.