Lead frame semiconductor device

摘要

A lead frame includes: a chip-mounting region provided on a front surface; a lead region including a plurality of concave and convex sections arranged in an in-plane direction of the chip-mounting region; and a terminal arranged in the concave section. A thickness of the lead region from the front surface is smaller than a thickness of the terminal from the front surface.

主权项

1. A lead frame comprising:
a chip-mounting region, a semiconductor chip being mountable onto a front surface of the lead frame in said chip-mounting region; a terminal electrically connectable to said semiconductor chip through a first wire, a gap along an in-plane direction being between said chip-mounting region and said terminal; and a lead region electrically connectable to said semiconductor chip through a second wire, said lead region extending in said in-plane direction from said chip-mounting region, wherein from said front surface to an opposite surface of the lead frame, a thickness of the lead region at said chip-mounting region is smaller than a thickness of the terminal, wherein a shape of a cross section of the terminal is a trapezoidal shape, said cross section of the terminal being wider at said opposite surface than at said front surface.