Lead frame including an insulating resin layer entirely covering lead surface, and semiconductor device including the same

摘要

A lead frame includes a plurality of leads defined by an opening extending in a thickness direction. An insulating resin layer fills the opening to entirely cover side surfaces of each lead and to support the leads. A first surface of each lead is exposed from a first surface of the insulating resin layer.

主权项

1. A lead frame comprising:
a plurality of leads defined by an opening extending in a thickness direction; and an insulating resin layer that fills the opening to entirely cover all side surfaces of each lead and to support the leads, wherein a first surface of each lead is exposed from and is substantially flush with a first surface of the insulating resin layer, each lead includes a second surface opposing the first surface of the lead, and the lead frame further includes a metal or alloy heat radiating plate adhered by an adhesive layer to the second surfaces of the leads wherein the heat radiating plate is electrically insulated from the plurality of leads.