Epitaxial growth susceptor

摘要

A susceptor for use in an epitaxial growth apparatus and method where a plurality of circular through-holes are formed in the bottom wall of a pocket in an outer peripheral region a distance of up to about ½ the radius toward the center of the circular bottom wall. The total opening surface area of these through-holes is 0.05 to 55% of the surface area of the bottom wall. The opening surface area of each of the through-holes provided at this outer peripheral region is 0.2 to 3.2 mm2 and the density of the through-holes is 0.25 to 25 per cm2. After a semiconductor wafer is mounted in the pocket, epitaxial growth is carried out while source gas and carrier gas (i.e., reactive gas) is made to flow on the upper surface side of the susceptor and carrier gas is made to flow on the lower surface side.

主权项

1. An epitaxial growth susceptor comprising a substantially circular bottom wall having an upper surface and a lower surface that forms a back surface of the susceptor and a sidewall encompassing the bottom wall to form a pocket for mounting a semiconductor wafer, having a clearance between a back surface of the semiconductor wafer to be mounted on the susceptor and the bottom wall, and a plurality of through-holes that pass through said bottom wall and form circular or polygonal openings in the upper surface and the lower surface of said bottom wall, an axis of each of the through-holes extending from the upper surface to the bottom surface of said bottom wall being a straight line, said plurality of through-holes being provided in the bottom wall only within a region of the bottom wall which is approximately half the radius of the bottom wall from the outer periphery to the center and which is located under the semiconductor wafer to be mounted on the susceptor and not between an outer edge of the semiconductor wafer to be mounted on the susceptor and said side wall, said plurality of through-holes being provided uniformly over the entirety of said region, and uneven portions are provided on a surface of the susceptor at an outer periphery of the susceptor on which the wafer is to be mounted so as to support the wafer by point contact, adjacent holes in a row of said through-holes in a bottom wall area located under the semiconductor wafer being connected by a channel to form a circular channel in an upper surface of the bottom wall of said pocket in the susceptor, said channel being a flat shallow channel having a width that is up to 1.5 times the diameter of a through-hole and a depth such that a cross-sectional area of a channel is from about 50% to about 100% an opening surface area of a through-hole.