| 发明名称 | Method for making a solder joint | ||
| 摘要 | A method of bonding an electrical component to a substrate includes applying solder paste on to a substrate. Solder preform has an aperture is formed therethrough and is then urged into contact with the solder paste, such that solder paste is urged through the aperture. An electrical component is then urged into contact with the solder preform and into contact with the solder paste that has been urged through the aperture, thereby bonding the electrical component, the solder preform, and the substrate together to define a reflow subassembly. | ||
| 申请公布号 | US8925793(B2) | 申请公布日期 | 2015.01.06 |
| 申请号 | US201213663698 | 申请日期 | 2012.10.30 |
| 申请人 | DunAn Microstaq, Inc. | 发明人 | Arunasalam Parthiban;Bhopte Siddharth;Ojeda, Sr. Joe Albert |
| 分类号 | B23K1/20;B23K35/14 | 主分类号 | B23K1/20 |
| 代理机构 | MacMillan, Sobanski & Todd, LLC | 代理人 | MacMillan, Sobanski & Todd, LLC |
| 主权项 | 1. A method of bonding a component to a substrate comprising: applying solder paste on to a substrate; urging a solder preform made of solder or braze material into contact with the solder paste, the solder preform having a channel in the form of at least one of an aperture and a notch formed therethrough, such that solder paste is urged through the channel in an amount sufficient to fill and at least partially spill over edges of the channel; and urging a component into contact with the solder preform and into contact with the solder paste that has been urged through the channel, thereby bonding the component, the solder preform, and the substrate together to define a reflow subassembly. | ||
| 地址 | Austin TX US | ||