MACHINING PROCESS OF SEMICONDUCTOR WAFER

摘要

An objective of the present invention is to process high flattening with respect a surface of a semiconductor wafer. A resin application and grinding step is repeatedly carried out, the step including determining as a reference surface a flat surface obtained by applying a curable material to one entire surface of a wafer sliced out from a semiconductor single crystal ingot with the use of a wire saw apparatus and performing surface grinding with respect to the other surface of the wafer, and determining as a reference surface the other surface of the wafer subject to the surface grinding and performing the surface grinding with respect to the one surface of the wafer.