<p>The present invention provides an apparatus for mounting solder balls using a solder ball mask which includes a stage which is configured to support a substrate, a ball placer head which is configured to provide the solder balls, and the solder ball mask which is configured to align the solder balls on the substrate. The solder ball mask includes a top mask layer which has a top opening part of a first diameter, a middle mask layer which has a middle opening part of a second diameter which is larger than the first diameter, and a bottom mask layer. The middle mask layer is thicker than the top mask layer.</p>
