| 发明名称 | Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated with the same | ||
| 摘要 | An epoxy resin composition for encapsulating a semiconductor device includes a curing agent, a curing accelerator, inorganic fillers, and an epoxy resin, the epoxy resin including a first resin represented by Formula 1:; wherein R1 and R2 are each independently hydrogen or a C1 to C4 linear or branched alkyl group, and n is a value from 1 to 9 on average. | ||
| 申请公布号 | US8928158(B2) | 申请公布日期 | 2015.01.06 |
| 申请号 | US201213478138 | 申请日期 | 2012.05.23 |
| 申请人 | Cheil Industries Inc. | 发明人 | Han Seung;Kim Ju Mi;Park Sung Su;Lee Eun Jung |
| 分类号 | H01L23/29;C08L63/04;C08G59/32;C09D163/04;C09J163/04 | 主分类号 | H01L23/29 |
| 代理机构 | Lee & Morse, P.C. | 代理人 | Lee & Morse, P.C. |
| 主权项 | 1. An epoxy resin composition for encapsulating a semiconductor device, the composition comprising: a curing agent; a curing accelerator; an inorganic filler; and an epoxy resin, the epoxy resin including a first resin represented by Formula 1: wherein: R1 and R2 are each independently hydrogen or a C1 to C4 linear or branched alkyl group, and n is a value from 1 to 9 on average, and the epoxy resin is present in an amount of about 1 to about 13 wt % in the composition. | ||
| 地址 | Gumi-si, Kyeongsangbuk-do KR | ||