| 发明名称 | Wiring board and method for manufacturing wiring board | ||
| 摘要 | A wiring board includes an interlayer insulation layer, conductive patterns formed on the interlayer insulation layer, and a solder-resist layer formed on the interlayer insulation layer and having an opening partially exposing the conductive patterns. The solder-resist layer has an edge portion bordering the opening and intersecting the conductive patterns, and the edge portion of the solder-resist layer has a concavo-convex shape having convex portions and concave portions such that the convex portions and the concave portions are alternately intersecting the conductive patterns. | ||
| 申请公布号 | US8927875(B2) | 申请公布日期 | 2015.01.06 |
| 申请号 | US201213562508 | 申请日期 | 2012.07.31 |
| 申请人 | IBIDEN Co., Ltd. | 发明人 | Furuta Toru;Takagi Fumitaka |
| 分类号 | H05K1/03;H05K3/34;H05K1/02;H05K3/10;H05K1/11;H05K3/46 | 主分类号 | H05K1/03 |
| 代理机构 | Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P. | 代理人 | Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P. |
| 主权项 | 1. A wiring board, comprising: an interlayer insulation layer; a plurality of conductive patterns formed on the interlayer insulation layer; and a solder-resist layer formed on the interlayer insulation layer and having an opening partially exposing the plurality of conductive patterns, wherein the solder-resist layer has an edge portion bordering the opening and intersecting the conductive patterns, the edge portion of the solder-resist layer has a concavo-convex shape having a plurality of convex portions and a plurality of concave portions such that the convex portions and the concave portions are alternately intersecting the conductive patterns, and the concavo-convex shape of the edge portion has the convex portions and concave portions in at least one of a wave form in a cycle and rectangular forms. | ||
| 地址 | Ogaki-shi JP | ||