Electronic device assemblies and vehicles employing dual phase change materials

摘要

Electronic device assemblies employing dual phase change materials and vehicles incorporating the same are disclosed. In one embodiment, an electronic device assembly includes a semiconductor device having a surface, wherein the semiconductor device operates in a transient heat flux state and a normal heat flux state, a coolant fluid thermally coupled to the surface of the semiconductor device, and a phase change material thermally coupled to the surface of the semiconductor device. The phase change material has a phase change temperature at which the phase change material changes from a first phase to a second phase. The phase change material absorbs heat flux at least when the semiconductor device operates in the transient heat flux state.

主权项

1. An electronic device assembly comprising:
a semiconductor device comprising a surface, wherein the semiconductor device operates in a transient heat flux state and a normal heat flux state; a housing configured to receive a coolant fluid thermally coupled to the surface of the semiconductor device; one or more thermally conductive features thermally coupled to the surface of the semiconductor device and disposed within the housing; and a phase change material disposed within the one or more thermally conductive features, the phase change material thermally coupled to the surface of the semiconductor device, the phase change material having a phase change temperature at which the phase change material changes from a first phase to a second phase, wherein the phase change material absorbs heat flux at least when the semiconductor device operates in the transient heat flux state.