Camera module and method of manufacturing the camera module

摘要

A camera module includes an image sensor chip including a substrate having first and second opposite surfaces and a ground pad on the first surface, a housing surrounding the sides of the image sensor chip but which leaves the second surface of the image sensor chip exposed, an electromagnetic wave-shielding film united with the housing, and an electrical conductor electrically connected to the ground pad. The camera module also has an optical unit disposed on the first surface of the image sensor chip in the housing to guide light from an object to the image sensor chip. The electrical conductor extends through a side of the housing. The conductor also contacts the electromagnetic wave-shielding film to electrically connect the ground pad and the electromagnetic wave-shielding film.

主权项

1. A method of manufacturing a camera module, comprising:
providing an image sensor chip including a substrate having first and second opposite surfaces, and a ground pad on the first surface of the substrate; providing a housing having a through-hole extending through a side thereof; providing a transparent member; providing the housing with an electromagnetic wave-shielding film; assembling the image sensor chip and the transparent member to the housing such that the first surface of the substrate of the image sensor chip faces the interior of the housing, the transparent member is disposed on the first surface of the substrate, the second surface of the substrate of the image sensor chip is exposed to the environment outside the housing, and the ground pad is exposed to the environment outside the housing via the through-hole in the housing; and forming an electrical conductor that is electrically connected to the ground pad including by filling the through-hole with conductive material.