Interlocking type solder connections for alignment and bonding of wafers and/or substrates

摘要

An apparatus comprising a first substrate and a second substrate. The first substrate has disposed thereon a first feature. The second substrate has disposed thereon a second feature. The first feature is configured to interlock with the second feature such that the first substrate and the second substrate are aligned by the first and the second features within a predefined accuracy.

主权项

1. An apparatus comprising:
a first substrate having a first surface, said first surface having disposed thereon a first feature, wherein said first feature (i) extends above said first surface and (ii) comprises a metal seedlayer on said first surface and a metal stack on said metal seedlayer; and a second substrate having a second surface, said second surface having disposed thereon a second feature, wherein
(a) said second feature (i) extends above said second surface and (ii) comprises a metal seedlayer on said second surface and a metal stack on said metal seedlayer, and(b) said first feature is configured to interlock with said second feature when said first feature is in direct contact with said second feature, such that said first substrate and said second substrate are aligned by said first and said second features within a predefined accuracy.