Sealant curing apparatus

摘要

A sealant curing apparatus is disclosed. In one embodiment, the apparatus includes a processing object panel, a panel supporting unit supporting the processing object panel and a voltage applying unit including a first electrode and a second electrode positioned on the panel supporting unit via the processing object panel interposed therebetween and having different polarities. The processing object panel includes: i) a conductive layer pattern including a heating unit that includes a lattice (grid) pattern, a connecting unit coupled to the first electrode and the second electrode, and a coupling unit connecting the heating unit and the connecting unit and ii) a sealant formed according to the heating unit.

主权项

1. A sealant curing apparatus comprising:
a processing object panel; a panel supporting unit configured to support the processing object panel; and a voltage applying unit comprising a first electrode and a second electrode that have different polarities and are positioned on the panel supporting unit, wherein the processing object panel is interposed between the voltage applying unit and the panel supporting unit, wherein the processing object panel comprises: a conductive layer pattern comprising i) a heating unit including a lattice pattern, ii) a connecting unit coupled to the first and second electrodes, and iii) a coupling unit interconnecting the heating unit and the connecting unit; and a sealant formed to correspond to the pattern of the heating unit.