| 发明名称 | Method of polishing a substrate using a polishing tape having fixed abrasive | ||
| 摘要 | A method of polishing a peripheral portion of a substrate is provided. This method includes: causing sliding contact between the peripheral portion of the substrate and a polishing tape; and supplying a polishing liquid onto the polishing tape contacting the peripheral portion of the substrate. The polishing tape includes a base tape and a fixed abrasive formed on the base tape, and the polishing liquid is an alkaline polishing liquid containing an alkaline chemical and an additive including molecules that cause steric hindrance. | ||
| 申请公布号 | US8926402(B2) | 申请公布日期 | 2015.01.06 |
| 申请号 | US201113303485 | 申请日期 | 2011.11.23 |
| 申请人 | Ebara Corporation | 发明人 | Nakanishi Masayuki;Seki Masaya;Kodera Kenji |
| 分类号 | B24B1/00;B24B9/06;B24B21/00;B24B37/02 | 主分类号 | B24B1/00 |
| 代理机构 | Wenderoth, Lind & Ponack, L.L.P. | 代理人 | Wenderoth, Lind & Ponack, L.L.P. |
| 主权项 | 1. A method of polishing a peripheral portion of a substrate, said method comprising: causing sliding contact between the peripheral portion of the substrate and a polishing tape; and supplying a polishing liquid onto the polishing tape contacting the peripheral portion of the substrate, wherein the polishing tape includes a base tape and a fixed abrasive formed on the base tape, and wherein the polishing liquid is an alkaline polishing liquid containing an alkaline chemical and an additive including molecules that cause steric hindrance. | ||
| 地址 | Tokyo JP | ||