发明名称 COMPOSITION COMPRISING POLYIMIDE PRECURSOR AND/OR POLYIMIDE, AND POLYIMIDE FILM
摘要 PROBLEM TO BE SOLVED: To provide a polyimide material that is excellent in heat resistance, transmittance, low linear expansion coefficient and low retardation.SOLUTION: This invention relates to a polyimide film comprising a tetracarboxylic acid residue and a diamine residue, where at least one of the tetracarboxylic acid residue and diamine residue has a bent site, and the polyimide film has a linear expansion coefficient of 60 ppm/K or less and a retardation of 200 nm or less.SELECTED DRAWING: None
申请公布号 JP2016128555(A) 申请公布日期 2016.07.14
申请号 JP20150169247 申请日期 2015.08.28
申请人 MITSUBISHI CHEMICALS CORP 发明人 YAMAGUCHI MIKA;SUGIYAMA JIRO;NOGUCHI HIROSHI;KOGA TOMOKO;ISHIKUBO AKIRA;KATO GOJI
分类号 C08J5/18;C08G73/10 主分类号 C08J5/18
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