| 摘要 |
PROBLEM TO BE SOLVED: To properly bond a plurality of chips arranged on w substrate with the substrate.SOLUTION: A bonding device 30 includes: a processing chamber 100 which has an upper chamber 101 and a lower chamber 102 to form a sealed space with the upper chamber 101 and the lower chamber 102; a table 150 which is provided inside the processing chamber 100 and on which a wafer W is placed; a heating mechanism provided in the table 150, for heating the wafer W; a gas supply mechanism 170 for supplying a pressurized gas to the inside of the processing chamber 100; an upper chamber base 110 for supporting the upper chamber 101; a lower chamber base 120 for supporting the lower chamber 102; an upper cooling mechanism 112 for cooling the upper chamber base 110; and a lower cooling mechanism 121 for cooling the lower chamber base 120.SELECTED DRAWING: Figure 5 |
