| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a wafer level packaging structure that can improve accuracy in alignment in screen printing a plurality of glass frit patterns on a wafer.SOLUTION: A manufacturing method of a wafer level packaging structure includes a step of forming a frame-like junction layer 4 by screen printing with a glass frit paste while surrounding the periphery of a plurality of individual device areas (in-plane wiring areas 8) formed on a glass wafer 20. Two second alignment marks 24a' and 24b' in printing glass frit patterns forming the junction layer 4 by screen printing are formed at corner parts of the four glass frit patterns (junction layer 4) surrounding the periphery of the adjacent four individual device areas; each of the corner parts 4a of the glass frit patterns has a notch shape in which the distance between the second alignment marks 24a' and 24b' are increased.SELECTED DRAWING: Figure 7 |
