Low cost manufacturing of micro-channel heatsink

摘要

A cooling device includes a ceramic substrate with a metal layer bonded to an outer planar surface. The cooling device also includes a channel layer bonded to an opposite side of the ceramic substrate and a manifold layer bonded to an outer surface of the channel layer. The substrate layers are bonded together using a high temperature process such as brazing to form a single substrate assembly. A plenum housing is bonded to the single substrate assembly via a low temperature bonding process such as adhesive bonding and is configured to provide extended manifold layer inlet and outlet ports.

主权项

1. A cooling device comprising:
a substrate assembly comprising:
a ceramic layer comprising a first planar surface and a second planar surface substantially parallel to the first planar surface;a metal layer bonded to the first planar surface;a channel layer bonded to the second planar surface; anda manifold layer bonded to a surface of the channel layer opposite the second planar surface, the ceramic, metal, channel, and manifold layers configured together as a single unitary substrate; and a discrete plenum housing that is distinct from and bonded to the substrate assembly and configured to provide manifold layer inlet and outlet ports.