Semiconductor device including external connection pads and test pads

摘要

A semiconductor device according to one embodiment of this invention includes: a semiconductor chip; a plurality of external connection pads and a plurality of first test pads, both of which are formed in a central region of a top surface of the semiconductor chip; a plurality of external connection electrodes each formed on a corresponding one of the external connection pads, the external connection electrodes being for connecting the external connection pads and an outside of the semiconductor device.

主权项

1. A semiconductor device comprising:
a semiconductor chip; a plurality of first pads, which include a plurality of external connection pads and a plurality of first test pads, the plurality of first pads formed in a central region of a top surface of said semiconductor chip, the plurality of first pads arranged in a matrix in which one of the first test pads and external connection pads are provided in the same line or the same column of the matrix; a plurality of second test pads provided on a periphery of the top surface of said semiconductor chip; and a plurality of circuits provided on said semiconductor chip; wherein a distance between two adjacent first test pads is larger than a distance between two adjacent second test pads, wherein said first test pads are arranged only above a circuit having a greatest power consumption among said circuits, wherein the device does not include any test pads arranged above other circuits besides the circuit having the greatest power consumption.