Bonding of substrates including metal-dielectric patterns with metal raised above dielectric and structures so formed

摘要

Bonding of substrates including metal-dielectric patterns on a surface with the metal raised above the dielectric, as well as related structures, are disclosed. One structure includes: a first substrate having a metal-dielectric pattern on a surface thereof, the metal-dielectric pattern including: a metal having a concave upper surface; and a dielectric having a substantially uniform upper surface, wherein the metal on the first substrate is raised above the dielectric on the first substrate; and a second substrate bonded with the first substrate, the second substrate including: a dielectric; and a metal positioned substantially below the dielectric of the second substrate, wherein the first substrate and the second substrate are bonded only at the metal from the first substrate and the metal from the second substrate.

主权项

1. A structure comprising:
a first substrate having a metal-dielectric pattern on a surface thereof, the metal-dielectric pattern including:
a metal having a concave upper surface, wherein the metal of the first substrate includes a metal cap; anda dielectric having a substantially uniform upper surface,wherein the metal on the first substrate is raised above the dielectric on the first substrate; and a second substrate bonded with the first substrate, the second substrate including:
a dielectric; anda metal positioned substantially below the dielectric of the second substrate, wherein the first substrate and the second substrate are bonded only at the metal from the first substrate and the metal from the second substrate.