Method and device for bonding two wafers

摘要

A device for bonding of two wafers on one joining surface V of the wafers. The device includes a pressure transfer means with a pressure surface D for applying a bond pressure to the two wafers on the pressure surface D, wherein the pressure surface D is smaller than the joining surface V. The invention also relates to a method for bonding of two wafers on one joining surface V of the two wafers, by pressure transfer means with a pressure surface D for action on the wafers (2, 3), wherein a bond pressure is applied in succession to partial sections of the joining surface V.

主权项

1. A device for bonding first and second wafers such that each of said first and second wafers are joined to each other, directly or indirectly, at a joining surface V located between the first and second wafers, said device comprising:
a holder for holding the first wafer having first and second surfaces, the second surface facing the holder; pressure transfer means having a pressure surface D that contacts a first surface of the second wafer for applying a bond pressure to the first and second wafers, said pressure surface D is smaller than the joining surface V, wherein a second surface of the second wafer faces toward the first surface of the first wafer; and means for contacting the pressure surface D, in succession, with a plurality of partial sections of the first surface of the second wafer, thereby applying the bond pressure at a respective plurality of partial sections of the joining surface V.