| 发明名称 | Apparatus and methods for movable megasonic wafer probe | ||
| 摘要 | Methods and apparatus for a movable megasonic wafer probe. A method is disclosed including positioning a movable probe on a wafer surface, the movable probe having an open bottom portion that exposes a portion of the wafer surface; applying a liquid onto the wafer surface through a bottom portion of the movable probe; and moving the movable probe at a predetermined scan speed to traverse the wafer surface, applying the liquid to the wafer surface while moving over the wafer surface. In additional embodiments the method includes providing a transducer for applying megasonic energy to the wafer surface. Apparatus embodiments are disclosed including the movable megasonic wafer probe. | ||
| 申请公布号 | US8926762(B2) | 申请公布日期 | 2015.01.06 |
| 申请号 | US201113226216 | 申请日期 | 2011.09.06 |
| 申请人 | Taiwan Semiconductor Manufacturing Company, Ltd. | 发明人 | Chien Ying-Hsueh Chang;Ku Shao-Yen;Yeh Ming-Hsi;Yang Chi-Ming;Lin Chin-Hsiang |
| 分类号 | B08B3/04;B08B3/12 | 主分类号 | B08B3/04 |
| 代理机构 | Slater & Matsil, L.L.P. | 代理人 | Slater & Matsil, L.L.P. |
| 主权项 | 1. A method, comprising: positioning a movable probe on a wafer surface, the movable probe having an open bottom portion that exposes a portion of the wafer surface, the movable probe further having a bottom foot portion; contacting the wafer surface with the bottom foot portion; applying a liquid onto the wafer surface through the open bottom portion of the movable probe while the bottom foot portion is contacting the wafer surface; and moving the movable probe at a predetermined scan speed to traverse the wafer surface, applying the liquid to the wafer surface while moving over the wafer surface. | ||
| 地址 | Hsin-Chu TW | ||