| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for controlling wettability only without substantially changing processibility, stress relaxation property, joinability, reliability, or the like in a Pb-based solder alloy for high temperature used for solder joining of various semiconductor elements such as die bonding of a power transistor element.SOLUTION: An objective Pb-based solder alloy contains by mass, preferably 1.0-10.0% Sn, preferably 1.3-5.0% Ag, 0.005% or less P, and the balance Pb with inevitable impurities. Wettability of the solder alloy is controlled by regulating a content of P within the above range. |
