发明名称 Optical bus in 3D integrated circuit stack
摘要 An optical bus of an integrated circuit comprises: a polymer waveguide, a micromirror, and an optical coupler. The polymer waveguide is disposed in a via formed through at least one die layer of the integrated circuit comprising an active circuit. The micromirror is disposed adjacent to the via and optically coupled to the polymer waveguide. The optical coupler is connected to the polymer waveguide to couple the active circuit to the optical bus. A stacked integrated circuit is described comprising such an optical bus. A method of fabricating a rear 45° micromirror on a silicon substrate that can be used in the optical bus is also described. Furthermore, alignment/lock mechanisms for use in a stacked integrated circuit comprising first and second silicon substrates are described.
申请公布号 US9401346(B2) 申请公布日期 2016.07.26
申请号 US201514592930 申请日期 2015.01.09
申请人 Kwok Chee Yee;Michael Aron;Xu Yiwei 发明人 Kwok Chee Yee;Michael Aron;Xu Yiwei
分类号 G02B6/12;G02B6/00;H01L23/544;H01L25/065;G02B6/42;G02B6/43;H01L21/302;H01L23/00 主分类号 G02B6/12
代理机构 Harness, Dickey & Pierce, PLC 代理人 Harness, Dickey & Pierce, PLC
主权项 1. An alignment/lock mechanism for use in a stacked integrated circuit comprising first and second silicon substrates, comprising: a pair of pre-shaped silicon springs formed in said first substrate, said springs oppositely facing each other; and a pin formed in the second substrate, said pin and said pair of silicon springs adapted for snap-fit engagement in a central portion of said silicon springs.
地址 St Ives AU