Semiconductor device package with organic interposer

摘要

A method of making an integrated circuit package, such as a ball grid array, includes providing a flexible tape that has first and second sets of bond pads on respective first and second surfaces thereof. A carrier is attached to the first surface of the flexible tape. Then conductive pillars are formed on the second set of bond pads and an intermediate layer of polymeric compound is deposited on the second surface of the flexible tape. After the compound has cured, a surface of the intermediate layer is ground to expose ends of the conductive pillars to form a sub-assembly comprising the flexible tape and the intermediate layer. Then the carrier is removed from the sub-assembly, thereby creating an interposer. The interposer is attached to a substrate and at least one die is attached to the interposer.

主权项

1. A method for assembling an integrated circuit package, the method comprising:
a) providing a flexible tape having first and second sets of bond pads on respective first and second surfaces thereof; b) attaching the first surface of the flexible tape to a carrier; c) forming conductive pillars on the second set of bond pads; d) depositing an intermediate layer of polymeric compound on the second surface of the flexible tape; e) grinding a surface of the intermediate layer to expose ends of the conductive pillars to form a sub-assembly comprising the flexible tape and the intermediate layer; f) removing the carrier from the sub-assembly, thereby creating an interposer; g) attaching the interposer to a substrate; h) attaching at least one die to the interposer, wherein, after step e) and before step f), the method further comprises:
attaching an additional flexible tape to the intermediate layer using an adhesive layer;forming openings in the additional flexible tape and the adhesive layer, thereby uncovering the exposed ends of the conductive pillars;depositing solder into the openings; andreflowing the solder to form solder plugs that connect the conductive pillars to conductive traces on the additional flexible tape,whereby the interposer includes the attached additional flexible tape; and overmolding the at least one die, the interposer, and a portion of the substrate with a molding compound, thereby leaving a surface of the substrate exposed.