| 摘要 |
The present invention relates to a sputtering method for suppressing an electro magnetic interference (EMI) from a semiconductor package using a liquid adhesive and a sputtering apparatus for same. The sputtering method using the liquid adhesive according to the present invention is a sputtering method for the semiconductor package, which includes the steps: (a) mounting a tray; (b) coating a liquid adhesive on the tray; (c) curing the liquid adhesive; (d) loading a plurality of semiconductor packages on the tray so that the semiconductor packages are attached to each other by the liquid adhesive; (e) performing a sputtering process for the semiconductor package; (f) unloading the semiconductor package from the tray; and (g) removing the liquid adhesive from the tray. Accordingly, the semiconductor package can be easily attached or detached by using the liquid adhesive for the sputtering apparatus, so that the semiconductor package can be automatically loaded or unloaded, thereby improving the productivity and the yield rate. |
