| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a both side cooling structure for internally cooling a high output electronic component which can be assembled without adding an extra member, or without damaging the environmental load.SOLUTION: A case assembly 10 houses a heat generating electronic component 12. A case includes first and second housing members 16, 30 cast from the same casting mold. In order to form a coolant flow path, a cover is mounted on the housing. In order to form an additional coolant flow path, the housing member includes built-in connection members 20, 22, 34, 36 to be coupled each other. One connection member has a lip 106 for accepting the end of the other connection member in hermetically sealed state. The lip is accepted by a slot 108 adjacent to the other connection member. The slot communicates with the outside of the housing.</p> |
