| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a plating rack used so that a plating thickness is uniformly provided for an object to be plated bent three-dimensionally, and a plating method using the plating rack.SOLUTION: A plating rack 10 is not only attached to a hanger 43 provided above a plating tank 1, but also provided with both a negative electrode 30 energizing an object to be plated 3 and a positive electrode 20 energizing a plating solution 2. The positive electrode 20 is formed of an insoluble metal, and includes a hook anode 31 receiving a positive current from the hanger 43 and a rack anode 23 surrounding the periphery of the object to be plated 3. The negative electrode 30 is attached to a hook cathode 31 receiving a negative current from the hanger 43, and includes an attached cathode 33 energizing a negative current.</p> |
