| 摘要 |
PROBLEM TO BE SOLVED: To provide a workpiece cutting method that enables perfect removal of sawdust.SOLUTION: In a workpiece cutting method for cutting, with a cutting blade, a plate-shaped workpiece having a surface on which devices are formed in respective regions compartmented by plural parting schedule lines formed in a grid form, a workpiece semiconductor wafer (11) is supported by an annular frame F through a dicing tape T, water-resoluble resin is applied on the surface of the workpiece to form a resin film 14, the resin film is irradiated with ultraviolet ray to be cured, a cutting blade 30 cuts into the workpiece from the surface thereof along the parting schedule lines while rotated at high speed, and water of a predetermined pressure or more is jetted onto the surface of the workpiece after the workpiece is divided into plural chips, and the resin film is removed from the workpiece, whereby sawdust 21 which occurs in the dividing step and adheres to the resin film is removed from the workpiece together with the resin film.SELECTED DRAWING: Figure 5 |
