| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a multiple piece wiring board capable of reducing variation in the thickness of plating applied to a wiring conductor in a wiring board region.SOLUTION: The multiple piece wiring board has a first coupling conductor 21-1 comprising folding patterns 24a, 24b formed on a first insulation layer and arranged alternately to the left and right of a border line 14 and connected with a plating electrode at at least one end, and a second coupling conductor 21-2 comprising a folding pattern 24c formed on a second insulation layer and arranged alternately to the left and right of the border line 14 and connected with the plating electrode at at least one end. At least one of the first coupling conductor 21-1 and second coupling conductor 21-2 has the folding pattern 24b not connected with the wiring conductor, and the folding pattern 24b not connected with the wiring conductor is connected with the folding pattern 24c on a different insulation layer by a via 25.</p> |
